CPU | AMD Ryzen™ AI Max+ 395 • 16 cores / 32 threads • TSMC 4nm FinFET process • Up to 5.1 GHz (MAX) • 16 MB L2 Cache / 64 MB L3 Cache • TDP: runs steadily at 120W (peak up to 140W) |
GPU | Radeon 8060S Graphics • 40-core RDNA 3.5 architecture |
AI NPU | Based on XDNA 2 architecture • 50 TOPS • Overall processor performance up to 126 TOPS • LM Studio: AI performance 2.2× higher than NVIDIA RTX 4090 with lower power consumption |
Memory (RAM) | Onboard LPDDR5X (non-upgradeable) • Options: 64GB or 128GB • Speed: 8000MHz |
Primary Storage (ROM) | PCIe 4.0 M.2 2280 SSD • Capacities: 2TB or 4TB • Supports PCIe 3.0/4.0 (SATA drives are not supported) |
Internal Storage Expansion | Dual M.2 2280 slots • Maximum total storage: 16TB (each slot supports up to 8TB via PCIe GEN4 x4) |
Video Output | Available via HDMI, DisplayPort, and USB4 • Maximum supported resolution: 7680×4320 @ 60Hz |
Network (WiFi & LAN) | WiFi: • Wifi7: RZ717(MT7925) Ethernet: • 1 × RJ45 Gigabit LAN (2.5G, 8125BG) |
Bluetooth | Bluetooth 5.4 |
Power – Charger | DC 19.5V, 11.8A (~230.1W) • AC Input: 100–240V, 50/60Hz, 4.0A |
Front Panel I/O | • 2 × USB-A 3.2 Gen2 • 1 × Audio Combo (3.5mm jack) • 1 × USB Type-C (USB4.0) • 1 × SD Card Reader (SD4.0, supports SDXC) • Buttons: Power, System Fan Lighting Control, Performance Mode Switch |
Rear Panel I/O | • 1 × DisplayPort 1.4 HBR3 (8.1 Gbps) • 1 × HDMI 2.1 (FRL at 8 Gbps) • 1 × USB-A 3.2 Gen2 • 2 × USB-A 2.0 • 1 × USB Type-C (USB4.0) • 1 × Audio (3.5mm CTIA) • 1 × DC IN (5525 interface) • 1 × RJ45 Gigabit LAN (2.5G, 8125BG) |
OS | • Window 11 Pro |
Chassis / Form Factor | • Dimensions: 193 mm x 185.8 mm x 77 mm • Chassis finish: B/C-grade metal with CNC sandblasted oxidized finish; A-shell plastic spray coating |
LLM support | • 64GB+1TB:DeepSeek-Rl: 32B • 128GB+2TB:DeepSeek-Rl: 32B, DeepSeek-R1: 70B, Lama 4: 109B |